Cover of EMC for Product Designers, 4th edition

EMC for Product Designers, 4th edition


(2007) 512 pages

Widely regarded as the standard text on EMC, Tim Williams' book provides all the information necessary to meet the requirements of the EMC Directive. Most importantly, it shows how to incorporate EMC design principles into products, avoiding cost and performance penalties, meeting the needs of specific standards and resulting in a better overall product.

This edition covers basic, generic and product-specific test standards, the latest standards on measurement methods and revisions to existing standards. Changes to the standards generating process are also covered. New measurement techniques are described. The chapter entitled Systems EMC explains requirements on systems design, layout of large systems, earthing, grounding and bonding practices, cable layout, routing and termination, and specification of components. A further chapter deals with EMC Management: discussion of management requirements, company policy, QA needs, the role of the EMC coordinator, including test and control plans. Tim Williams has worked for a variety of companies as an electronic design engineer over the last 20 years. He has monitored the progress of the EMC Directive and its associated standards since it was first made public. He is a member of the Institution of Electrical Engineers and now runs his own consultancy, specializing in EMC design and training. He is also the author of 'The Circuit Designer's Companion' published by Butterworth-Heinemann.

Contents; Preface@ Part 1: The Directive, Standards and Testing@ Chapter 1 Introduction@ What is EMC?:Compatibility between systems:The scope of EMC:The compatibility gap:The EMC Directive:The new approach directives:Background to the legislation:Scope, requirements and exceptions:The CE mark and the declaration of conformity:Manufacturing yuality assessment:Systems and installations:Implementation, enforcement and sanctions:Compliance with the Directive:Self certification The technical construction file:The transition period:Telecomms terminal and satellite ea:rth station equipment radio transmitters:Testing and the competent body:Standards:Action for compliance:@ Chapter 2 Standards@ The standards making bodies:The International Electro technical Commission:CENELEC:Basic and generic standards - emissions:EN 50 ()81 part 1: 1992*:EN 50 081 part 2: 1993*:EN 55 011: 1991 *:EN 55 014: 1993*:EN 55 022: 1994*:Generic standards-immunity:EN 50 082 part I: 1992 *:EN 50 082 part 2: 1995*:Basic standards - IEC 1000:IEC 1000-3:IEC 1000-4:Product standards:EN 55 013: 1990*:EN 55 015: 1993*:EN 55 020: 1933:EN 55 104: 1995*:EN 50 065-1: 1991 *:EN 60 601-1-2: 1993*:EN 60 945: 1993*:ETS 300 127: 1994 pr:ETS 300 339:Automotive standards:Other product standards in development:Other standards not related to the EMC Directive:FCC Rules:German standards:Other nonharmonized standards:RF emissions limits:@ Chapter 3 EMC measurements@ RF emissions:Measurement instrumentation:Transducers:Facilities:Test methods:Sources of uncertainty:RF immunity:Equipment:Facilities:Test methods:Conducted RF immunity:ESD and transient immunity:ESD:Transients:Sources of uncertainty:Evaluation of results:Performance criteria:Mains harmonic emission:Equipment:Test conditions:@ Part 2: Design Principles@ Chapter 4 Interference coupling mechanisms@ Source and victim:Common impedance coupling:Mains coupling:Radiated coupling:Coupling modes:Emissions:Radiated emissions:Conducted emissions:Susceptibility:Radiated field:Transients:Electrostatic discharge:Magnetic fields:Supply voltage phenomena:Mains harmonics:The supplier's problem:Non-linear loads:@ Chapter 5 Layout and grounding@ Equipment layout and grounding:System partitioning:Grounding:Ground systems:Grounding and layout of large systems:PCB layout:Ground layout without a ground plane:Ground plane:Loop area:Configuring 1/0 grounds:Rules for PCB layout:@ Chapter 6 Digital and analogue circuit design@ Design for emissions control:The Fourier spectrum:Radiation from logic circuits:Digital circuit decoupling:Analogue circuits: emissions:The switching power supply:Design for immunity:Digital circuits: interference paths:Logic noise immunity:The microprocessor watchdog:Defensive programming:Transient and RF immunity: analogue circuits:Chapter 7 Interfaces, filtering and shielding@ Cables and connectors:Cable segregation and returns:Cable screens at low frequencies:Cable screens at RF:Types of cable screen:Screened cable connections:Unscreened cables:Filtering and suppression:Filter configuration:Components:Mains filters:I/O filtering:Transient suppression:Contact suppression:Shielding:Shielding theory:LF magnetic fields:The effect of apertures:The image plane:Enclosure resonance:Shielding hardware:@ Chapter 8 EMC management@ Managing the EMC process:Putting EMC in context:The EMC co-ordinator:Control plan:The purpose of the control plan:Contents:Test plan:The need for a test plan:Contents:Test and calibration procedures:Susceptibility criteria:Production QA testing:@ Appendix A Design checklist@ Appendix B CAD for EMC@ Overview:Available packages:Circuit CAD:@ Appendix C Useful tables and formulae@ The deciBel:Antennas:Fields:Shielding:Capacitance, inductance and pcb layout:Filters:Fourier series:@ Appendix D The EU and EEA countries@ The European Union:The European Economic Area:@ Glossary; Bibliography; Index