Cover of Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

Michael G. Pecht, Patrick McCluskey, Rakish Agarwal, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

(1999) 128 pages

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.

Electronic Packaging Materials and Their Properties: examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time.

Applications discussed include:


; printed circuit boards

; substrates

; encapsulants

; dielectrics

; die attach materials

; electrical contacts

; thermal materials

; solders

Electronic Packaging Materials and Their Properties: also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Features:: Discusses the use of materials and reliability issues related to them and their interfaces

; Reviews critical electrical, thermal, mechanical, and chemical properties

; Analyzes electronic packaging architectures - ranging from zeroth to third levels

; Demonstrates how the levels of packaging or packaging architectures classify materials and their performance



Properties of Electronics Packaging Materials

Electrical Properties; Thermal and Thermomechanical Properties

; Mechanical Properties

; Chemical Properties

; Miscellaneous Properties

Zeroth-Level Packaging Materials


Attachment Materials


First-Level Packaging Materials

Wire Interconnects

; Tape Interconnects

; Case Materials

; Lid Seals

; Leads

Second-Level Packaging Materials

Reinforcement Fiber Materials

; Resins

; Laminates

; Constraining Cores

; Flexible Wiring Board Materials

; Conductor Metals in Laminates

; Conformal Coatings

Third-Level Packaging Materials

Backpanel Materials

; Connectors Materials

; Cables and Flex Circuit Materials