@ Part I: Background and Fundamentals: Introduction, Mohamed Gad-el-Hak, University of Notre Dame @ Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation @ Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University @ Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame @ Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University @ Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University @ Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University @ Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A& M University @ Lubrication in MEMS, Kenneth S. Breuer, Brown University @ Physics of Thin Liquid Films, Alexander Oron, Technion, Israel @ Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame @ Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame @ Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego @ Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame @ Part II: Design and Fabrication: Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University @ MEMS Fabrication, Marc J. Madou, Nanogen, Inc. @ LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. @ X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories @ Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation @ Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center @ Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center @ Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. @ Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center @ Part III: Applications of MEMS: Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. @ Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison @ Sensors and Actuators for Turbulent Flows. Lennart Lö fdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame @ Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories @ Microrobotics Thorbjö rn Ebefors and Gö ran Stemme, Royal Institute of Technology, Sweden @ Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. @ Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan @ Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute @ Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology @ Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) @ Part IV: The Future: Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University @ Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University @ Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame @ Index: