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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

G.Q. Zhang, L.J. Ernst, O. de Saint Leger, eds.

2000

204 pages

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.

Main areas covered are:-

The impact of simulation on industry profitability
Approaches to simulation
The state-of-the-art methodologies of simulation
Design optimization by simulation
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Contents